BERGQUIST GAP FILLER TGF 4000 is thermally conductive and will cure at room temperature or can be accelerated with heat. The mixed system extends working time offering improved manufacturing flexibility and the low-level natural tack characteristics are ideal for assemblies where strong structural bonds are not required.
- Thermal conductivity: 4 W/m-K
- Ultra-conforming, with excellent wet-out
- 100% solids – no cure by-products
- Extended working time for manufacturing flexibility
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