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BERGQUIST GAP PAD TGP 1100SF is a silicone-free, thermally conductive gap pad. Being silicone free, there is no silicone outgassing and silicone extraction. It is not only thermally conductive but also electrically isolating. This product is therefore ideal for silicone sensitive applications.
- Thermal conductivity: 0.9 W/m-K
- Silicone free
- Room temperature as well as accelerated curing possible
- UL94 V-1 compliance
| Carrier type | Fiberglass |
| Colour | Green |
| Flame rating | V-1 |
| Operating temperature | -60.0 - 125.0 °C |
| Standard thickness | 0.254 - 3.175 mm |
| Thermal conductivity | 0.9 W/mK |
BERGQUIST-GAP-PAD-TGP-1100SF-TDS.pdf
Size: 68.24 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 8in x 16in x 0.125, 8in x 16in x 0.04, 8in x 16in x 0.02, 8in x 16in x 0.01, 16in x 8in x 0.08 sh, 8in x 16in x 0.06, 3.62in x 7.13in x 0.04, 16in x 8in x 0.015 sh |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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