BERGQUIST GAP PAD TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances.It is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly
- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Designed for low-stress applications
- Highly Conformable, low hardness
Reviews
There are no reviews yet.