BERGQUIST GAP PAD TGP 2101SF 8in x 16in
Part number: 2168567£151.45 ex.VAT (£181.74 inc.VAT)
BERGQUIST GAP PAD TGP 2101SF is a silicone-free, high performance, thermally conductive gap filling material.
Available to order. Your estimated delivery is: 09/05/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material
The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive applications. BERGQUIST GAP PAD TGP 2101SF is reinforced for easy material handling and added durability during assembly. BERGQUIST GAP PAD TGP 2101SF offers exceptionally low interfacial resistances to adjacent surfaces and is constructed using a 1 mil polyester film on one side and natural tack on the other . The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly.
- Thermal Conductivity: 2.0 W/m-K
- No silicone outgassing
- No silicone extraction
- Tack on one side for easy handling
| Carrier type | Polyester |
| Colour | Green |
| Operating temperature | -60.0 - 125.0 °C |
| Standard thickness | 0.254 - 3.175 mm |
| Technology | Silicone |
| Thermal conductivity | 2.0 W/mK |
| Young's modulus, ASTM D575 | 228.0 KPa (33.0 psi ) |
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BERGQUIST-GAP-PAD-TGP-2101SF-TDS.pdf
Size: 69.38 kB
Type: pdf
| Weight | 0.24998 kg |
|---|---|
| Packaging | 8in x 16in |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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