BERGQUIST GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.
- Thermal conductivity: 2.0 W/m-K
- Silicone-free formulation
- 0.5 mil film provides tack-free surface
- Minimal compression set
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