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It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Ultra low modulus
- Non-fiberglass option for applications that require an additional reduction in stress
| Colour | Blue |
| Operating temperature | -60.0 - 200.0 °C |
| Technology | Silicone |
| Thermal conductivity | 3.0 W/mK |
| Product Type | Thermal gap pads,Thermal management materials |
BERGQUIST-GAP-PAD-TGP-3000ULM-TDS.pdf
Size: 69.65 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 1.0mm, L 16in x W 8in x H 1.5mm, L 16in x W 8in x H 3.0mm, L 16in x W 8in x H 2.0mm, L 16in x W 8in x H 2.5mm |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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