BERGQUIST GAP PAD TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating. Options and Configurations Standard sheet size – 8″ x 16″ or custom configurationStandard thickness available – 0.020″, 0.040″, 0.060″, 0.080″, 0.100″, 0.125″ Custom made configurations available upon request
- Thermal Conductivity: 1.0 W/m-K
- Electromagnetic Interference (EMI) absorbing
- Fiberglass reinforced for puncture, shear and tear resistance
- Highly conformable, low hardness
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