The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
- Available in roll form with kiss-cut parts
- Thermally conductive 55°C phase change compound
- Hi-Flow® coating will resist dripping
- Thermal impedance: 0.07ºC-in2 /W @ 25 psi
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