BERGQUIST HI FLOW THF 1600G, Fiberglass-Reinforced, Phase Change Thermal Interface Material
BERGQUIST HI FLOW THF 1600G is designed as a thermal interface material between a computer processor and a heat sink.Above the phase change temperature, BERGQUIST HI FLOW THF 1600G wets-out the thermal interface surfaces and flows to produce low thermal impedance. The material requires pressure of the assembly to cause flow. BERGQUIST HI FLOW THF 1600G will not drip or run like grease
- Will not drip or run like grease
- Phase change compound coated on a fiberglass carrier
- Thermal impedance: 0.20°C-in2/W (@25 psi)
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