This product performs functions of both a thermal interface material and a structural adhesive. This product is ideal for automotive applications like electronics, power supplies pumps, and automotive modules. This product is curable at room temperature, however, the cure rate can also be accelerated with application of heat.
- Thermal conductivity: 2.0 W/m-K
- High bond strength
- Adaptable cure mechanism
- High elongation modulus
- UL94 V-0 compliance