BERGQUIST LIQUI FORM TLF 6000HG is a unique formula that effectively provides electronic component cooling capability for remote antenna assembly and 5G base stations where reliability in vertical gap stability is required. The pre-cured gel doesn’t require mixing or refrigeration and is ideal for filling narrow gaps that measure
- Thermal conductivity: 6.0 W/m-K
- Dispensable pre-cured gel
- Stable viscosity in storage and in the application
- Excellent chemical stability and mechanical stability
Reviews
There are no reviews yet.