BERGQUIST LIQUI FORM TLF LF2000 is a thermally conductive, pre-cured, and dispensable gel material that exhibits low volumetric expansion. With excellent chemical and mechanical stability even at high temperatures, this product applies very low force on components during assembly while offering reliable long-term performance.
- Applies very low force on components during assembly
- Low volumetric expansion
- Thermal Conductivity: 2.0 W/m-K
- Excellent chemical and mechanical stability even at high temperatures
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