BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforced, Thermally Conductive Elastomeric Material.
The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw and clip mounted applications.
- Thermal impedance: 0.53°C-in2/W (@50 psi)
- Exceptional thermal performance at lower application pressures
- Superior breakdown voltage and surface “wet out” values
- Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction