BERGQUIST SIL PAD TSP 3500 is a thermally conductive insulating material that is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass providing high reliability for electronic packaging applications. Typical applications include, power supplies, motor controls, power semiconductors, aerospace, and avionics.
- Thermal impedance: 0.33°C-in2/W at 50 psi
- High thermal conductivity 3.5 W/m-K
- Optimal heat transfer