BERGQUIST SIL PAD TSP A3000 is for applications where optimal heat transfer is a requirement. This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications.
- Optimal heat transfer
- Thermal impedance: 0.32°C-in2/W (@50 psi)
- Reduced interfacial resistance results in improved overall thermal performance when measured at lower pressures
- High thermal conductivity: 3.0 W/m-K