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BERGQUIST SIL PAD TSP Q2000
From £0.27
BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths.
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Same day dispatch if you place your order before 3.30pm
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Please note packaging may vary
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BERGQUIST SIL PAD TSP Q2000, Fiberglass-Reinforced, Silicone based, Grease Replacement Thermal Interface
BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
- Thermal impedance: 0.35°C-in2/W (@50 psi)
- Eliminates processing constraints typically associated with grease
- Easy handling
- Conforms to surface textures
| Carrier type | Glass Fibre |
| Colour | Black |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 180.0 °C |
| Technology | Silicone |
| Thermal conductivity | 0.2 W/mK |
BERGQUIST-SIL-PAD-TSP-Q2000-TDS.pdf
Size: 62.02 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 12in x 12in x 0.005, 100mm x 30m, 0.75in x 0.41in x 0.005, 12in x 12in x 0.005 gaac, 0.75in x 0.8in x 0.005, 99.2mm x 54mm, 200 x 200mm, 250ft x 12in x 0.005 rl gaac, 250ft x 12in x 0.005 rl, 0.71in x 0.5in x 0.005 gaac, 12in x 12in x 0.005in gaac, 1.5in x 0.59in, 1.38in x 1.18in x 0.005 gaac, 11.807in x 3.15in x 0.005, L 105mm x W 32mm x H 0.005 |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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