BERGQUIST SIL PAD TSP T1200 is ideal for applications requiring average thermal conductivity and economy. BERGQUIST SIL PAD TSP T1200 is designed to meet VDE, U.L. and TUV agency requirements.
Features
- Thermal Conductivity: 0.9 W/m-K
- For clip-mounted plastic power packages
Typical applications
- Clip-mounted power semiconductors
- TO-220, TO-218, TO-247 and TO-3P
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