BERGQUIST SIL PAD TSP T1200 is ideal for applications requiring average thermal conductivity and economy. BERGQUIST SIL PAD TSP T1200 is designed to meet VDE, U.L. and TUV agency requirements.
- Thermal Conductivity: 0.9 W/m-K
- For clip-mounted plastic power packages
- Clip-mounted power semiconductors
- TO-220, TO-218, TO-247 and TO-3P