Cobar Solder Paste SN100C XF-3 (Sn99-Cu0.7-Ni-Ge) 500g Jar

It can also be used in Vapour Phase reflow systems. The minimal residues are non corrosive, and conform to a wide range of standards for corrosion resistance in service including Bellcore and IPC . Cobar XF-3+ has good print characteristics down to 12 mil pitch and 150 mm per second print speed at typical ambient temperatures of 20 deg. C. XF-3 is based on Nihon Superior patent alloy technology (fully patent license paid), combined with the latest Cobar Flux technology.

It features an exceptional tack time of up to 48 hours. XF-3 has a wide process window with peak reflow temperaturs typically up to 245 deg. C. Residues can be left, but if removal is required, localized cleaning can be carried out with Surclean Ecosolve 200 and 300, or Surclean SC2500 for batch type or automatic cleaning. Standard pack sizes are 500gm tubs, and 40gm techon type syringes. Other pack types are available subject to minimum order quantities.