PD 955 M is a thermosetting single component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components onto PCBs and for use on bare substrates. This rheology is specially adapted for high speed dispensing.
- Very wide processing window, no tendency towards stringing
- Excellent adhesion with standard and also with difficult to glue components
- Consistent batch-to-batch quality
Before curing: The adhesive can be removed with Zestron HC and other Zestron and Vigon cleaning materials. Do not use alcohol as this will cure the adhesive. Cleaned dispensing units should be completely dried before installation.
After Curing: Defective components can be replaced by heating (with hot air) the cured adhesive joint above 100 °C. After removing the component (torsion movement), the hot air should be focused on the remaining adhesive in order to remove it with a sharp tool.