PD 955 PY is a thermosetting single component, solvent-free polymer adhesive, developed especially for the surface mountingof SMT components onto PCBs and for use on bare substrates. This rheology is specially adapted for printing application with metal and pump print-stencil.
- Excellent adhesion with standard and also with difficult to glue components
- Very high green strength prevents component movement during placement
- Ideal, high dot form and excellent consistency of the glue dots