High-Performance Staking and Vibration Protection UV Gel
HumiSeal UV20GEL is a fast curing, non-sag thixotropic paste which cures to give a flexible urethane acrylate that bonds well to engineered plastics and metal-based substrates. In addition to the UV cure, this material has a secondary moisture cure mechanism to ensure cure in areas shadowed from UV light. HumiSeal UV20GEL is designed for staking and vibration dampening applications, but doubles as a high-performance adhesive for general PCB bonding applications.
|• Vibration Protection||• Sag Resistant / Thixotropic Paste||• PCB components|
|• Mechanical Shock Protection||• Fast UV Cure||• PET/RPET|
|• Components Staking||• UV Fluorescing||• PVC|
|• PET/RPET Clamshell Bond||• Shadow Area Cure||• Various Metals|
|• RoHS & REACH Compliant||• Polycarbonate|
|• GB 33372-2020 Compliant|
HumiSeal UV20GEL is a highly cross-linked material. In order to achieve maximum cross-link density and physical performance, the product must be exposed to the correct spectral output.
HumiSeal UV20GEL can be cured using arc, microwave, or LED systems. Exact dosage is application dependent, however recommended dosage is 4 J/cm2 for arc and microwave systems and 10 J/cm2 for LED lamps.
HumiSeal UV20GEL contains a reliable secondary moisture cure mechanism which will cure any shadow areas on the assembly within 7-10 days at ambient moisture.
HumiSeal UV20GEL should be stored in a cool, dry, and dark location at a temperature between 1°C to 25°C. Material is sensitive to moisture, UV, and visible light. Consult SDS for safe handling recommendations. Consult packaging labels for recommended shelf life.
Application of HumiSeal UV20GEL should be carried out in accordance with local and National Health and Safety regulations. Use only in well-ventilated areas to avoid inhalation of vapors. Avoid contact with skin and eyes.
Consult SDS prior to use.