TACFlux 089HF is a no-clean flux formulated for lead-free and tin-lead solders. TACFlux 089HF provides excellent wetting in air or nitrogen atmospheres. The flux and flux residue is halogen-free.
TACFlux 089HF is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner.
Peak reflow temperature should be <260°C in an air or nitrogen atmosphere.