PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system.
• Application by dipping or dispensing
• Halogen-free (no intentionally-added halides)
• Optimized for Pb-free (SAC alloy) applications
• Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes
• Air reflow
• Bubble-free packaging
PoP Flux 89HF-LV is designed for no-clean applications, and can be left in place on the final package. If necessary, flux residues can be removed by using a commercially available flux cleaner. Contact an Indium Corporation Technical Support Engineer for recommendations on flux cleaners.
PoP Flux 89HF-LV is packaged in air-free 30cc syringes.
The volume of flux on the package can be optimized by changing equipment parameters. Key variables include: sphere size, sphere pitch, flux shear speed, and dwell. Viscosity can be optimized per application by appropriate equipment setup.