Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT. Composition: Sn96.5 Ag3 Cu0.5.
Indium Corp Lead Free Solder Paste 8.9 SAC305 Type 3 88.5% 500g CartridgePart number: 800449
£72.00 ex.VAT (£86.40 inc.VAT)
Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures. Composition: Sn96.5 Ag3 Cu0.5.
3 in stock
Additional stock available on 28/12/2021, if ordered today
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