Indium Corp Lead Free Solder Paste 8.9HFA SAC305 Type 4 88% 1kg Cartridge
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. Composition: Sn96.5 Ag3 Cu.5.
Features
- Eliminates clogged apertures through advanced rheology
- High speed printing (>100mm/second capable)
- Eliminates hot and cold slump
- Excellent wetting
- High oxidation resistance
- Halogen-free per EN14582 test method
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