Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Composition: Sn96.5 Ag3 Cu.5. (SAC305)
• Eliminates clogged apertures through advanced rheology
• High speed printing (>100mm/second capable)
• Eliminates hot and cold slump
• Excellent wetting
• High oxidation resistance
• Halogen-free per EN14582 test method