Indium Corp Lead Free Solder Paste 8.9HFA SAC305 Type 4 88.5%
From £83.00
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
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Same day dispatch if you place your order before 3.30pm
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Please note packaging may vary
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Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Composition: Sn96.5 Ag3 Cu.5. (SAC305)
Features
- Eliminates clogged apertures through advanced rheology
- High speed printing (>100mm/second capable)
- Eliminates hot and cold slump
- Excellent wetting
- High oxidation resistance
- Halogen-free per EN14582 test method
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8.9HFA-TDS.pdf
Size: 0.00
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 500g Jar, 1.2kg Cartridge |
| package size | |
| Alloy | |
| Flux Type |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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