Indium Corp Lead Free Solder Paste Water-Soluble 3.1 SAC305 Type 3 88.5%
Indium3.1 is a Pb-Free Water-soluble Solder Paste, with excellent wetting and printing. Designed for low voiding with outstanding slump resistance. Available for both printing and dispensing in a variety of packing to suit most applications. The residues can be easily cleaned with water at no less than 60psi and 55 DegC. Composition: Sn96.5 Ag3 Cu0.5.
- Exceptional printing
- Long stencil life
- Wide reflow profile window
- Outstanding slump resistance
- Excellent wetting compatibility
- Superior fine-pitch soldering ability
- Low foam
Storage and Handling Procedures:
Refrigerated storage will prolong the shelf life of solder paste. The shelf life of Indium3.1 is no less than 4 months when stored at less than 10°C.
Solder paste should be allowed to reach ambient working temperature prior to use (about 4–6 hours). Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Use paste within 8 hours of exposure to atmosphere. Jars and cartridges should be labeled with date and time of opening.
When storing solder paste contained in syringes and cartridges, the solder paste should be stored with the tip down.
Indium3.1 exhibits excellent wetting under both air and nitrogen reflow atmosphere. The solder joints yielded are shiny and smooth, including those of ultrafine-pitch components.
Indium3.1 has low-voiding performance, including joints of BGAs and CSPs.
Residue Cleaning: Residue is easily cleaned with water at no less than 60psi and 55°C. The optimal spray pressure and temperature are a function of the board complexity and the efficiency of cleaning equipment.
This is best performed using an automated stencil cleaning system for both stencil and misprint cleaning to prevent extraneous solder particles. Most commercially available stencil cleaners and isopropyl alcohol (IPA) work well.