It contains a heat-stabilized rosin that provides excellent wetting and solder spread on various metallizations used in Pb-free assembly processes.
- Optimized for use with Pb-free assembly processes
- Fast and excellent wetting to Pb-free surface finishes including immersion Ag, ENIG, and OSP
- Bellcore GR-78 compliant
- Resistant to charring
- Minimal spattering and low odor
- Composition: 95.5Sn 3.8Ag 0.7Cu
- Size: 0.25mm (0.010″) diameter