It also solders quite well while still meeting the most recent J-STD-004B type ROL0 criteria. Because CW-807 contains less than 500ppm total halogen, it is halogen-free according to J-STD-004B and JEITA ET-7304. Because CW-807 meets the more stringent Surface Insulation Resistance (SIR) and Electromigration (ECM) standards of J-STD-004 revision B, the no-clean residue is electronically safe for almost all applications. Additionally, when properly configured*, cored wire with CW-807 produces superior outcomes in automated soldering procedures such as laser soldering.
- Halogen-free according to J-STD-004B* The formula must contain less than 500ppm of any kind of halogen, ionic or nonionically bound chlorine, bromine, or fluorine to be halogen-free according to J-STD-004B. This is new to J-STD-004B since fluxes that meet the original J-STD-004 or J-STD-004A may still contain halogens that only dissociate at soldering temperatures but leave an ionic halogen residue.
- Light-colored, low-smoke, rosin-containing flux Rosin, modified rosins, and resins all contribute to improved heat stability and dependability; nevertheless, rosins and resins can interfere with probe-testability in some circumstances.
- Tested compatibility with Hot Air Solder Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG), and Organically Solder Preserved (OSP) Copper surfaces.
- Tested for use with all common lead-free and tinlead alloys, including: SAC305; SAC105; SAC0307; SACm®; 96.5Sn/3.5Ag; 63Sn/37Pb; 60Sn/40Pb; 93.5Pb/5Sn/1.5Ag; Indalloy®227; Indalloy®254; silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995; and many others.