It provides excellent solder spread with minimal smoking and low odor. The fast wetting speed is beneficial in minimizing rework cycle time which is typically longer with Pb-free solders.
- Optimized for use with Sn/Pb and Pb-free assembly and rework processes
- Excellent cleanability with cold water
- Fast and excellent wetting to common Pb-free surface finishes including: ImSn, ENIG, OSP, and ImAg
- Minimal spattering and low odor
- Resistant to charring
- Composition: Sn96.5 Ag3 Cu0.5
- Size: 0.25mm (0.010″) diameter