Loctite 3619 Chipbonder Epoxy Adhesive

LOCTITE 3619 – Non-Conductive Adhesive

• One component
• High dispense speed
• High wet strength
• Red

TYPICAL CURING PERFORMANCE

Recommended conditions for curing are exposure to heat above 100°C (typically 90 to 120 seconds @ 100 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.

Directions for use:

1. LOCTITE 3619 is supplied de-aerated in a range of ready-to-use syringes which fit straight into a variety of air pressure/time dispensing systems commonly available.
2. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 2 to 4 hours.
3. Avoid cross contamination with other adhesive residues by ensuring dispense nozzels, adapters etc. are thoroughly cleaned.
4. Do not leave dirty nozzles on dispensing equipment while not in use or soaking in solvents for long periods of time.
5. The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature.
6. These parameters will vary depending on the type of dispensing system used and should be optimised accordingly.
7. Dispensing temperature should ideally be controlled at a value between 30 °C to 35 °C for optimum results, however higher dispense temperatures are possible.
8. LOCTITE 3619 can also be dispensed using positive displacement pump systems.
9. The product is not recommended for dispensing by pin transfer.
10. Uncured adhesive can be cleaned from the board with isopropanol, MEK or ester blends such as LOCTITE 7360.