This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
- Non-conductive
- Single component
- Fast cure
- Low cure temperature
This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
Applications | Die Attach |
Coefficient of Thermal Expansion (CTE) | 54.0 ppm/°C |
Coefficient of Thermal Expansion (CTE), Above Tg | 128.0 ppm/°C |
Cure Schedule, Recommended @ 110.0 °C | 90.0 sec. |
Cure Type | Heat Cure |
Extractable Ionic Content, Chloride (CI-) | 29.0 ppm |
Extractable Ionic Content, Potassium (K+) | 19.0 ppm |
Extractable Ionic Content, Sodium (Na+) | 89.0 ppm |
Glass Transition Temperature (Tg) | 120.0 °C |
Hot Die Shear Strength | 7.0 kg-f |
Key Characteristics | Conductivity: Electrically Non-Conductive |
RT Die Shear Strength | 25.0 kg-f |
Tensile Modulus, DMTA @ 25.0 °C | 68.0 N/mm² (10000.0 psi ) |
Thermal Conductivity | 0.35 W/mK |
Thixotropic Index | 4.2 |
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa·s (cP) |
Size: 68.36 kB
Type: pdf
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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