LOCTITE 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.15
Viscosity, Cone & Plate, mPa·s (cP),
Temperature: 25 °C, Shear Rate: 36 s -1:
3,000 to 6,000LMS
Pot life @ 22 °C, hours 48
Flash Point – See SDS
Recommended Curing Conditions
10 minutes @ 150 °C
15 minutes @ 120 °C
30 minutes @ 100 °C
Note: With all fast cure systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.