LOCTITE® ABLESTIK 50298 is designed to be used as an alternative to silver-filled epoxy adhesives in applications where a lower conductivity is sufficient.
Features
- Two component
- Electrically conductive
- Thixotropic
- Easy application
DIRECTIONS FOR USE
1. All surfaces to be bonded should be clean and free of grease, dirt, and other chemical contaminants.
2. Mix each component well prior to weighing to assure uniform consistency.
3. Accurately weigh out the required amount of part A and part B as stated in the mix ratio
4. Mix Parts A and B together thoroughly.
5. Apply adhesive to all surfaces to be bonded and join together.
TYPICAL CURING PERFORMANCE
Cure Schedule
24 hours @ 25°C or
2 hours @ 65°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage : ≤25 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
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