In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.
| Cure Schedule, @ 150.0 °C | 30.0 min. |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | 50.0 °C |
| Physical Form | Film |
| Shear Strength, Aluminum | 1700.0 psi |
| Technology | Epoxy |
| Thermal Conductivity | 1.6 W/mK |
Size: 66.16 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 561-1-004, 1.457" x 5.945", 100µm, 561-1-005, 12" x 12" SH, 125µm |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
Free Delivery Over £75
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