LOCTITE ABLESTIK 8006NS

This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.

• B-Stageable
• Offers improved printability
• Non-conductive
• Engineered to accurately control bondline thickness and die tilt