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The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
- Electrically Insulating
- Engineered for accurate bondline control
- One component
- Long work life
| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 41.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Above Tg | 112.0 ppm/°C |
| Cure Type | Heat Cure |
| Extractable Ionic Content, Chloride (CI-) | 10.0 ppm |
| Extractable Ionic Content, Potassium (K+) | 20.0 ppm |
| Extractable Ionic Content, Sodium (Na+) | 5.0 ppm |
| Glass Transition Temperature (Tg) | 87.0 °C |
| RT Die Shear Strength | 21.0 kg-f |
| Tensile Modulus, @ 250.0 °C | 172.0 N/mm² (25000.0 psi ) |
| Thermal Conductivity | 0.5 W/mK |
| Thixotropic Index | 2.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 20000.0 mPa·s (cP) |
LOCTITE-ABLESTIK-84-3J-TDS.pdf
Size: 66.13 kB
Type: pdf
| Weight | N/A |
|---|---|
| package size | |
| Packaging | 5 cc, 10 cc |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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