£49.33 ex.VAT (£59.20 inc.VAT)
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant.
Available to order. Your estimated delivery is: 05/01/2024
LOCTITE ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
| Applications | Encapsulating |
| Cure Schedule, @ 125.0 °C | 2.0 hr. |
| Cure Type | Heat Cure |
| Number of Components | 1 Part |
| Storage Temperature | -40.0 °C |
| Technology | Epoxy |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 360500.0 mPa·s (cP) |
Size: 64.38 kB
Type: pdf
| Weight | 0.0225 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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