It is designed for high speed, automated assembly operations.
- Electrically conductive
- Stress absorbing
- Low levels of contaminants
- Void-free bondline with minimal bleed
LOCTITE ABLESTIK 965-1L 3cc
Part number: 1190237£162.36 ex.VAT (£194.83 inc.VAT)
LOCTITE ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion.
Available to order. Your estimated delivery is: 05/01/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
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| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 50.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Above Tg | 190.0 ppm/°C |
| Color | Gray: Silver |
| Cure Schedule, @ 150.0 °C | 1.0 hr. |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | 72.0 °C |
| Hot Die Shear Strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 0.6 kg-f |
| RT Die Shear Strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 10.0 kg-f |
| Thermal Conductivity | 3.0 W/mK |
| Thixotropic Index | 4.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12000.0 mPa·s (cP) |
| Volume Resistivity | ≤ 0.0005 Ohm cm |
LOCTITE-ABLESTIK-965-1L-TDS.pdf
Size: 66.69 kB
Type: pdf
| Weight | 0.0099 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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