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LOCTITE ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
- Non-conductive
- Single component
- Fast cure
- Low cure temperature
| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 50.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Above Tg | 135.0 ppm/°C |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | 118.0 °C |
| Thermal Conductivity | 1.0 W/mK |
| Thixotropic Index | 4.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa·s (cP) |
LOCTITE-ABLESTIK-ABP-2035SCR-TDS.pdf
Size: 63.76 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 5cc, 10cc |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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