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LOCTITE ABLESTIK ABP 6892 BA
Part number: 2594374£89.80 ex.VAT (£107.76 inc.VAT)
LOCTITE ABLESTIK ABP 6892 BA non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties.
Available to order. Your estimated delivery is: 07/11/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This material provides excellent adhesion to a
variety of surfaces.
- Transparent
- Low temperature cure
- Fast cure
- Low stress
- Low moisture absorption
- Filler-free
- Technology: BMI Acrylate
- Appearance: Transparent liquid
- Cure: Heat cure
- Application: Component assembly, Non-conductive die attach paste
LOCTITE-ABLESTIK-ABP-2032S-TDS.pdf
Size: 66.46 kB
Type: pdf
| Weight | 0.005 kg |
|---|
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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