A package using this material will have a greater resistance to delamination and overall improvement in package reliability.
- Non-conductive
- Halogen free
- Low viscosity
- Low modulus
LOCTITE ABLESTIK ABP 6892
From £155.50
LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties.
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
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| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 111.4 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Above Tg | 190.6 ppm/°C |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | -25.0 °C |
| Thixotropic Index | 1.75 |
| Viscosity, Brookfield, @ 25.0 °C Speed 0.5 rpm | 4100.0 mPa·s (cP) |
LOCTITE-ABLESTIK-ABP-6892-TDS.pdf
Size: 67.23 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 5cc, 5cc/10cc |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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