LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 47.0 ppm/°C |
| Cure Type | Heat Cure |
| Extractable Ionic Content, Chloride (CI-) | 9.0 ppm |
| Extractable Ionic Content, Potassium (K+) | 9.0 ppm |
| Extractable Ionic Content, Sodium (Na+) | 9.0 ppm |
| Hot Die Shear Strength | 5.6 psi |
| RT Die Shear Strength | 12.18 kg-f |
| Tensile Modulus, DMTA @ 250.0 °C | 1280.0 N/mm² (185505.0 psi ) |
Size: 68.83 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 5cc, 10cc |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
Free Delivery Over £75
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