LOCTITE ABLESTIK ABP 8065T

Name: LOCTITE ABLESTIK ABP 8065T
SKU: LOCTITE-ABLESTIK-ABP-8065T
Price: 677.85 GBP
Availability: BackOrder

£677.85

LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive.

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LOCTITE ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.

Medium to high thermal conductivity
No channel void issue
High die shear strength
High electrical conductivity

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	146.0 ppm/°C
Cure Type	Heat Cure
Thermal Conductivity	10.0 W/mK
Thixotropic Index	6.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9000.0 mPa·s (cP)

LOCTITE-ABLESTIK-ABP-8065T-TDS.pdf
Size: 70.02 kB
Type: pdf

Weight	N/A
Packaging	5.3cc/10cc, 10cc

Delivery info

Shipment method	Shipment cost
Click and Collect	FREE
Next day (orders above £75.00 ex.vat)	FREE
Next day (orders below £75.00 ex.vat)	£6.99
Next day pre 12AM	£17.99
Next day pre 10AM	£20.99
Saturday AM	£45.00