LOCTITE ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
- Medium to high thermal conductivity
- No channel void issue
- High die shear strength
- High electrical conductivity