LOCTITE ABLESTIK ABP 8067TA

LOCTITE ABLESTIK ABP 8067TA highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metal leadframes. This product is specially designed to deliver long open time and minimized RBO on various surfaces including Au, PPF, etc. The material is hydrophobic and stable at high temperatures for better reliability performance.

• One component
• High thermal conductivity
• High electrical conductivity
• Long open time
• Minimal RBO
• High die shear strength