LOCTITE ABLESTIK ABP 8068TD is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (Backside Metallization). This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages such as SiP.
- One component
- Good workability
- Good adhesion to PPF, Ag, Cu and Au
- Good adhesion to BSM Si die and Non-BSM Si die
- High thermal conductivity
- High electrical conductivity
- High reliability