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LOCTITE ABLESTIK ABP 8303A
From £87.87
LOCTITE ABLESTIK ABP 8303A silver filled, conductive die attach adhesive is recommended for use in bonding integrated circuits and components to metal substrates.
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
Its moderate modulus, high adhesion and low stress enable robust bonding of medium/large sized dice on a wide variety of metal surfaces, including Cu, Ag and PPF. This product is particularly suitable for packages in which tight control of resin bleed out is required. The material is hydrophobic and stable at high temperatures.
- Technology: BMI Hybrid
- Appearance: Silver paste
- Cure: Heat cure
- Application: Component assembly, Conductive die attach paste
- Typical Package Application(s): QFP, QFN and other metal leadframe packaging
- Key Substrates: Cu, Ag or PPF
LOCTITE-ABP-8303A-TDS.pdf
Size: 71.79 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 17.5g, 35g |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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