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LOCTITE ABLESTIK ABP 8420
Part number: 2237517£139.34 ex.VAT (£167.21 inc.VAT)
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive.
Available to order. Your estimated delivery is: 07/11/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
LOCTITE ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.
- Non-conductive
- Excellent resin bleed out (RBO) performance
- Fast cure
- Black pigmentation for blocking stray light
| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 54.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Above Tg | 154.0 ppm/°C |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | 75.0 °C |
| Thermal Conductivity | 0.3 W/mK |
| Thixotropic Index | 5.8 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13500.0 mPa·s (cP) |
LOCTITE-ABLESTIK-ABP-8420-TDS.pdf
Size: 67.66 kB
Type: pdf
| Weight | 0.007 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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