LOCTITE ABLESTIK ABP 8920TC 10cc
Part number: 2629468£137.08 ex.VAT (£164.50 inc.VAT)
LOCTITE ABLESTIK ABP 8920TC, semiconductor die attach paste, high thermal conductivity.
Available to order. Your estimated delivery is: 08/07/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe.
LOCTITE ABLESTIK ABP 8920TC thermally conductive die attach paste is specially designed for applications requiring good thermal management and robust mechanical properties.
- High MRT performance
- High thermal conductivity
- Good adhesion
- Good electrical insulation
- Small and controlled particle size
- Technology: BMI Hybrid
- Appearance: White paste
- Filler Type: Alumina
- Cure: Heat cure
- Application: Electronic Material, Semiconductor Die Attach Paste
- Key Substrates: BT, Copper, Silver, PPF and Alloy 42
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LOCTITE-ABLESTIK-ABP-8920TC-TDS.pdf
Size: 77.81 kB
Type: pdf
| Weight | 0.0135 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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