It combines process ease with the proven reliability.
- Fast cure
- Non-conductive
- Thin bondline
- Excellent gap filling ability
It combines process ease with the proven reliability.
Adhesive Film Thickness | 10.0 µm |
Carrier Film Thickness | 85.0 µm |
Dicing Tape Diameter | 12.0 |
Extractable Ionic Content, Chloride (CI-) | 10.0 ppm |
Extractable Ionic Content, Fluoride (F-) | 10.0 ppm |
Extractable Ionic Content, Potassium (K+) | 10.0 ppm |
Extractable Ionic Content, Sodium (Na+) | 10.0 ppm |
Hot Die Shear Strength | 2.0 kg-f |
RT Die Shear Strength | 40.0 kg-f |
Tensile Modulus, DMTA @ 250.0 °C | 2.0 N/mm² (230.0 psi ) |
Wafer Diameter | 12.0 |
Weight Loss, @ 300.0 °C | <1.0 % |
Size: 67.42 kB
Type: pdf
Weight | N/A |
---|---|
Packaging | 110U_53, 8" wafer x 10µm, 6140, 120U_25, 8" wafer x 20µm, 6107, 120U_50M, 8" without D/T |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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